General Description:

• Design, fabrication, and testing of new wide bandgap (silicon carbide, gallium nitride, etc.) semiconductor devices. 
• The candidate will be responsible for designing devices and fabrication processes in order to realize new, high performance semiconductor products.
• The candidate will work with the Sales and Marketing Team to define product families and markets.
• The design activity will utilize state-of-the-art process and device simulation tools (Cadence, Medici, Taurus, etc.) to design and optimize high performance wide bandgap power semiconductor devices, including the development of accurate materials and process databases.
• The candidate will be responsible for unit process development of the specific processes necessary for fabricating devices from wide bandgap materials.  The fabrication responsibility includes interfacing with an existing fabrication line, and stewarding fabrication of wide bandgap devices.
• The candidate will evaluate semiconductor device performance through semiconductor device testing, both hands-on and by working with dedicated device test groups.  This will require day-to-day familiarity with standard semiconductor test equipment, including semiconductor parameter analyzers, source-measurement units and curve tracers.
• The candidate will be responsible for technical reporting of engineering and development results both by written reports and verbal presentations.  The candidate must be able to communicate clearly and accurately.
• In order to maintain an on-going awareness of market and technology needs the candidate will be responsible for frequent communication with a product-line team and a sales and marketing team.
• The candidate must be able to integrate both with the wide bandgap team, and numerous teams within the fabrication facility.  Good interpersonal, managerial, and organizational skills are required.
• The candidate may be required to supervise up to 5 members of the technical staff.